Reflow soldering is one of the easiest and most cost-effective ways of soldering components onto a printed circuit board.
Once the components have been lined up on the board in the correct position, a small amount of solder paste is applied to temporarily attach the electronic parts to their connecting pads. From this, the entire board is placed into a specialist reflow oven and subjected to a controlled heat, which melts the paste, securing each component in place and creating a permanent joint.
This process is the most common form of soldering and can be used for both conventional and surface mount assemblies.
We do the majority of our soldering with the aid of our ERSA Hotflow oven. This specialist reflow oven features four vertical heated zones and both top and bottom heaters, which helps create a smooth and secure solder without damaging or overheating either board or component.
The Hotflow oven can also accommodate a variety of board sizes and its speed can also be adjusted, which can help speed up production times without impacting quality.